русский
Español
Français
Home / News / Industry News / Metal Substrates Keep Losing Paint — ADP Adhesion Promoter Improves Bonding
Industry News
Industrial Coating · Automotive Parts · Appliances · Hardware · ADP
As industrial coating quality requirements continue to rise, metal substrates such as aluminium, zinc, stainless steel, and electroplated parts are widely used in automotive components, appliances, hardware, and electronic products. However, these substrate surfaces are smooth and adhesion is difficult — if coating-substrate bonding is insufficient, paint loss, cracking, and other problems easily occur during subsequent processing or use, affecting product appearance and service life.
Traditional Surface Preparation Only
- Sanding, blasting or chemical pre-treatment increases production steps and cost
- Results affected by substrate type and process conditions
- Limited improvement for interlayer adhesion and durability
- Cannot easily address multiple substrate types in one workflow
With ADP Adhesion Promoter
- Improves film-to-metal bonding without changing existing production process
- Simultaneously improves flexibility, impact resistance, and solvent wipe resistance
- Helps reduce baking temperature — supports energy-efficient production
- Effective across aluminium, zinc, stainless steel, and electroplated substrates
ADP: Adhesion Promoter for Difficult Metal Substrates
ADP is an adhesion promoter suitable for coating systems that improves film adhesion to aluminium, zinc, stainless steel, and electroplated difficult metal substrates. While improving adhesion, the product also enhances film ductility and impact resistance — making the coating more stable under external force and less likely to crack or peel. ADP also improves film solvent wipe resistance and helps reduce system baking temperature, supporting energy-efficient production and improved application efficiency.
Recommended addition: 0.5%–1.5% of total formulation weight, adjustable based on system requirements.
| Substrate Adhesion | Improves film bonding to aluminium, zinc, stainless steel, and electroplated substrates — reduces paint loss during service |
| Impact Resistance | Enhances film ductility and impact resistance — coating is more stable under external force |
| Solvent Wipe Resistance | Improves resistance to alcohol and organic solvent wiping — enhances use reliability |
| Baking Temperature | Helps reduce system cure temperature — supports energy-efficient production |
| System Compatibility | Suitable for amino baking coatings and 2K PU industrial coating systems |
For difficult metal substrates such as aluminium, zinc, stainless steel, and electroplated parts, traditional processes alone are often insufficient to achieve both adhesion and comprehensive film performance. Adding ADP adhesion promoter appropriately can improve film-to-substrate bonding, impact resistance, solvent wipe resistance, and processing adaptability — providing a more stable and reliable solution for industrial coating.
Frequently Asked Questions
Does ADP work on all the listed metal substrates at the same dosage?
The recommended dosage range of 0.5%–1.5% covers the effective range across typical substrate types. The optimal dosage within this range may vary between substrate types and coating formulations — a trial evaluation on the specific substrate and system at incrementally adjusted dosage is the recommended approach to confirm the optimal addition level before production.
Can ADP reduce baking temperature enough to allow cold-cure or room-temperature cure?
ADP helps reduce the baking temperature required in amino baking and 2K PU systems — it can lower the minimum cure temperature relative to the same formulation without ADP, but does not enable cold-cure or room-temperature cure on its own. The extent of temperature reduction depends on the specific system and should be confirmed by a cure study at the target conditions.
